MediaTek launches Dimensity 7300 and Dimensity 7300X with dual display support

MediaTek today presented two new SoCs, the Dimensions 7300 And Dimensions 7300X. Successors to the Dimensity 7050, they are built on a 4nm process. MediaTek says chips are priority energetic efficiency and performance to enable seamless multitasking, premium photography, accelerated gaming, and AI-powered computing. THE Dimensity 7300X specifically targets foldable flip-style devices, thanks to its dual-screen support.

Both chipsets feature an octa-core CPU configuration including 4 Cortex-A78 cores pointed at up to 2.5 GHz And 4 Arm Cortex-A55 cores. They offer up to 25% lower power consumption in A78 cores compared to their 6nm predecessor. Combined with the latest GPU Arm Mali-G615 and MediaTek HyperEngine optimizations, these processors improve gaming experiences, delivering 20% ​​faster FPS and 20% improved power efficiency compared to their competitors, according to the manufacturer. Additionally, intelligent resource optimization, optimized 5G and Wi-Fi gaming connections, and support for Bluetooth LE Audio with Dual-Link True Wireless Stereo Audio further enhance gaming capabilities.

The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can stream and game seamlessly.said Dr. Yenchi Lee, deputy general manager of MediaTek’s wireless communications business. “Additionally, the Dimensity 7300X enables OEMs to develop innovative new form factors with its dual display support.»

Dimensity 7300 chipsets improve photographic performance with the MediaTek Imagiq 950featuring a 12-bit HDR ISP support a 200 MP main camera. Hardware engines for precise noise reduction, face detection and HDR video improve image and video quality in various lighting conditions. THE APU655 provides better efficiency of AI tasks by offering double the performance of its predecessor and accommodate new mixed-precision data types for memory efficiency.

Additionally, MediaTek’s MiraVision 955 integrated into Dimensity 7300 SoCs supports detailed WFHD+ displays with 10-bit true colors and global HDR standards, improving streaming and media playback. Key features also include MediaTek 5G UltraSave 3.0+ technology for power efficiency, fast 5G downlink speeds, Wi-Fi 6E support, and 5G dual SIM support with dual VoNR.

MediaTek launches Dimensity 7300 and Dimensity 7300X with dual display support

  • MediaTek 5G UltraSave 3.0+ technology integrates a full suite of R16 power-saving enhancements along with MediaTek optimizations, resulting in a significant 13-30% increase in power efficiency compared to competing offerings in typical 5G connectivity settings below 6 GHz (according to MediaTek). .
  • 5G downlink speeds of up to 3.27 Gbps through 3CC carrier aggregation, ensuring fast downloads, especially in urban and suburban areas.
  • Support for 5G dual SIM and dual VoNR

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